JPH0481330B2 - - Google Patents

Info

Publication number
JPH0481330B2
JPH0481330B2 JP58146321A JP14632183A JPH0481330B2 JP H0481330 B2 JPH0481330 B2 JP H0481330B2 JP 58146321 A JP58146321 A JP 58146321A JP 14632183 A JP14632183 A JP 14632183A JP H0481330 B2 JPH0481330 B2 JP H0481330B2
Authority
JP
Japan
Prior art keywords
conductor layer
base
package
semiconductor device
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58146321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6038841A (ja
Inventor
Takashi Miwa
Atsushi Pponda
Koji Nakamura
Kanji Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58146321A priority Critical patent/JPS6038841A/ja
Publication of JPS6038841A publication Critical patent/JPS6038841A/ja
Publication of JPH0481330B2 publication Critical patent/JPH0481330B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58146321A 1983-08-12 1983-08-12 半導体装置 Granted JPS6038841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58146321A JPS6038841A (ja) 1983-08-12 1983-08-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58146321A JPS6038841A (ja) 1983-08-12 1983-08-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS6038841A JPS6038841A (ja) 1985-02-28
JPH0481330B2 true JPH0481330B2 (en]) 1992-12-22

Family

ID=15405022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58146321A Granted JPS6038841A (ja) 1983-08-12 1983-08-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS6038841A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634255U (ja) * 1992-10-09 1994-05-06 日本航空電子工業株式会社 高速作動用ピン立パッケージ
JP4005451B2 (ja) 2002-08-29 2007-11-07 富士通株式会社 多層基板及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431586B2 (en]) * 1972-08-18 1979-10-08
JPS53121165A (en) * 1977-03-30 1978-10-23 Tokyo Shibaura Electric Co Printed circuit board
JPS5449475A (en) * 1977-09-28 1979-04-18 Aisin Seiki Co Ltd Saffty circuit for multi-channel brake fluid control system
JPS5542508A (en) * 1978-09-18 1980-03-25 Mitsui Concrete Kogyo Kk Fish bank block
JPS5646599A (en) * 1979-09-25 1981-04-27 Nippon Electric Co Producing wiring board
JPS57107059A (en) * 1980-12-25 1982-07-03 Fujitsu Ltd Semiconductor package
JPS5833857A (ja) * 1981-08-21 1983-02-28 Nec Corp 半導体装置
JPS58134450A (ja) * 1982-02-05 1983-08-10 Hitachi Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS6038841A (ja) 1985-02-28

Similar Documents

Publication Publication Date Title
KR100252731B1 (ko) 반도체 디바이스 및 반도체 디바이스용 패키지
US6218731B1 (en) Tiny ball grid array package
US6229702B1 (en) Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability
EP1374305B1 (en) Enhanced die-down ball grid array and method for making the same
US5489059A (en) Semiconductor device having an universal die size inner lead layout
KR100574727B1 (ko) 반도체 장치
US6982488B2 (en) Semiconductor package and method for fabricating the same
US6057601A (en) Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate
US5705851A (en) Thermal ball lead integrated package
KR100604821B1 (ko) 적층형 볼 그리드 어레이 패키지 및 그 제조방법
JP3123638B2 (ja) 半導体装置
JP2001520460A (ja) マイクロ電子デバイス用パッケージの放熱特性を改善する方法及び構造
US5168345A (en) Semiconductor device having a universal die size inner lead layout
JPH1056093A (ja) 半導体装置およびその半導体装置を組み込んだ電子装置
JPH0777258B2 (ja) 半導体装置
US6710438B2 (en) Enhanced chip scale package for wire bond dies
JPS6042620B2 (ja) 半導体装置の封止体
JPS6220707B2 (en])
JPH0481330B2 (en])
JPH08274214A (ja) 半導体装置
JP2982182B2 (ja) 樹脂封止型半導体装置
JP3418759B2 (ja) 半導体パッケージ
KR19980025890A (ko) 리드 프레임을 이용한 멀티 칩 패키지
KR0173930B1 (ko) 리드 프레임을 이용한 볼 그리드 어레이 패키지
JPH11289031A (ja) 半導体装置及びその製造方法